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			280 lines
		
	
	
		
			10 KiB
		
	
	
	
		
			Plaintext
		
	
	
	
	
	
| Generic Thermal Sysfs driver How To
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| ===================================
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| 
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| Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
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| 
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| Updated: 2 January 2008
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| 
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| Copyright (c)  2008 Intel Corporation
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| 
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| 
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| 0. Introduction
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| 
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| The generic thermal sysfs provides a set of interfaces for thermal zone
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| devices (sensors) and thermal cooling devices (fan, processor...) to register
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| with the thermal management solution and to be a part of it.
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| 
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| This how-to focuses on enabling new thermal zone and cooling devices to
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| participate in thermal management.
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| This solution is platform independent and any type of thermal zone devices
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| and cooling devices should be able to make use of the infrastructure.
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| 
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| The main task of the thermal sysfs driver is to expose thermal zone attributes
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| as well as cooling device attributes to the user space.
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| An intelligent thermal management application can make decisions based on
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| inputs from thermal zone attributes (the current temperature and trip point
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| temperature) and throttle appropriate devices.
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| 
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| [0-*]	denotes any positive number starting from 0
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| [1-*]	denotes any positive number starting from 1
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| 
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| 1. thermal sysfs driver interface functions
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| 
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| 1.1 thermal zone device interface
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| 1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name,
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| 		int trips, void *devdata, struct thermal_zone_device_ops *ops)
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| 
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|     This interface function adds a new thermal zone device (sensor) to
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|     /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the
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|     thermal cooling devices registered at the same time.
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| 
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|     name: the thermal zone name.
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|     trips: the total number of trip points this thermal zone supports.
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|     devdata: device private data
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|     ops: thermal zone device call-backs.
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| 	.bind: bind the thermal zone device with a thermal cooling device.
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| 	.unbind: unbind the thermal zone device with a thermal cooling device.
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| 	.get_temp: get the current temperature of the thermal zone.
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| 	.get_mode: get the current mode (user/kernel) of the thermal zone.
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| 	    - "kernel" means thermal management is done in kernel.
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| 	    - "user" will prevent kernel thermal driver actions upon trip points
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| 	      so that user applications can take charge of thermal management.
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| 	.set_mode: set the mode (user/kernel) of the thermal zone.
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| 	.get_trip_type: get the type of certain trip point.
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| 	.get_trip_temp: get the temperature above which the certain trip point
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| 			will be fired.
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| 
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| 1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
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| 
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|     This interface function removes the thermal zone device.
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|     It deletes the corresponding entry form /sys/class/thermal folder and
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|     unbind all the thermal cooling devices it uses.
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| 
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| 1.2 thermal cooling device interface
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| 1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name,
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| 		void *devdata, struct thermal_cooling_device_ops *)
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| 
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|     This interface function adds a new thermal cooling device (fan/processor/...)
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|     to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself
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|     to all the thermal zone devices register at the same time.
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|     name: the cooling device name.
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|     devdata: device private data.
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|     ops: thermal cooling devices call-backs.
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| 	.get_max_state: get the Maximum throttle state of the cooling device.
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| 	.get_cur_state: get the Current throttle state of the cooling device.
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| 	.set_cur_state: set the Current throttle state of the cooling device.
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| 
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| 1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
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| 
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|     This interface function remove the thermal cooling device.
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|     It deletes the corresponding entry form /sys/class/thermal folder and
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|     unbind itself from all the thermal zone devices using it.
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| 
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| 1.3 interface for binding a thermal zone device with a thermal cooling device
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| 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
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| 		int trip, struct thermal_cooling_device *cdev);
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| 
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|     This interface function bind a thermal cooling device to the certain trip
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|     point of a thermal zone device.
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|     This function is usually called in the thermal zone device .bind callback.
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|     tz: the thermal zone device
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|     cdev: thermal cooling device
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|     trip: indicates which trip point the cooling devices is associated with
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| 	  in this thermal zone.
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| 
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| 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
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| 		int trip, struct thermal_cooling_device *cdev);
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| 
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|     This interface function unbind a thermal cooling device from the certain
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|     trip point of a thermal zone device. This function is usually called in
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|     the thermal zone device .unbind callback.
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|     tz: the thermal zone device
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|     cdev: thermal cooling device
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|     trip: indicates which trip point the cooling devices is associated with
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| 	  in this thermal zone.
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| 
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| 2. sysfs attributes structure
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| 
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| RO	read only value
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| RW	read/write value
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| 
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| Thermal sysfs attributes will be represented under /sys/class/thermal.
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| Hwmon sysfs I/F extension is also available under /sys/class/hwmon
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| if hwmon is compiled in or built as a module.
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| 
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| Thermal zone device sys I/F, created once it's registered:
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| /sys/class/thermal/thermal_zone[0-*]:
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|     |---type:			Type of the thermal zone
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|     |---temp:			Current temperature
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|     |---mode:			Working mode of the thermal zone
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|     |---trip_point_[0-*]_temp:	Trip point temperature
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|     |---trip_point_[0-*]_type:	Trip point type
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| 
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| Thermal cooling device sys I/F, created once it's registered:
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| /sys/class/thermal/cooling_device[0-*]:
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|     |---type:			Type of the cooling device(processor/fan/...)
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|     |---max_state:		Maximum cooling state of the cooling device
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|     |---cur_state:		Current cooling state of the cooling device
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| 
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| 
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| Then next two dynamic attributes are created/removed in pairs. They represent
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| the relationship between a thermal zone and its associated cooling device.
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| They are created/removed for each successful execution of
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| thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
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| 
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| /sys/class/thermal/thermal_zone[0-*]:
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|     |---cdev[0-*]:		[0-*]th cooling device in current thermal zone
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|     |---cdev[0-*]_trip_point:	Trip point that cdev[0-*] is associated with
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| 
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| Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
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| the generic thermal driver also creates a hwmon sysfs I/F for each _type_
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| of thermal zone device. E.g. the generic thermal driver registers one hwmon
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| class device and build the associated hwmon sysfs I/F for all the registered
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| ACPI thermal zones.
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| 
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| /sys/class/hwmon/hwmon[0-*]:
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|     |---name:			The type of the thermal zone devices
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|     |---temp[1-*]_input:	The current temperature of thermal zone [1-*]
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|     |---temp[1-*]_critical:	The critical trip point of thermal zone [1-*]
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| 
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| Please read Documentation/hwmon/sysfs-interface for additional information.
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| 
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| ***************************
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| * Thermal zone attributes *
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| ***************************
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| 
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| type
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| 	Strings which represent the thermal zone type.
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| 	This is given by thermal zone driver as part of registration.
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| 	E.g: "acpitz" indicates it's an ACPI thermal device.
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| 	In order to keep it consistent with hwmon sys attribute; this should
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| 	be a short, lowercase string, not containing spaces nor dashes.
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| 	RO, Required
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| 
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| temp
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| 	Current temperature as reported by thermal zone (sensor).
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| 	Unit: millidegree Celsius
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| 	RO, Required
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| 
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| mode
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| 	One of the predefined values in [kernel, user].
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| 	This file gives information about the algorithm that is currently
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| 	managing the thermal zone. It can be either default kernel based
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| 	algorithm or user space application.
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| 	kernel	= Thermal management in kernel thermal zone driver.
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| 	user	= Preventing kernel thermal zone driver actions upon
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| 		  trip points so that user application can take full
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| 		  charge of the thermal management.
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| 	RW, Optional
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| 
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| trip_point_[0-*]_temp
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| 	The temperature above which trip point will be fired.
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| 	Unit: millidegree Celsius
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| 	RO, Optional
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| 
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| trip_point_[0-*]_type
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| 	Strings which indicate the type of the trip point.
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| 	E.g. it can be one of critical, hot, passive, active[0-*] for ACPI
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| 	thermal zone.
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| 	RO, Optional
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| 
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| cdev[0-*]
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| 	Sysfs link to the thermal cooling device node where the sys I/F
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| 	for cooling device throttling control represents.
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| 	RO, Optional
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| 
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| cdev[0-*]_trip_point
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| 	The trip point with which cdev[0-*] is associated in this thermal
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| 	zone; -1 means the cooling device is not associated with any trip
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| 	point.
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| 	RO, Optional
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| 
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| passive
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| 	Attribute is only present for zones in which the passive cooling
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| 	policy is not supported by native thermal driver. Default is zero
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| 	and can be set to a temperature (in millidegrees) to enable a
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| 	passive trip point for the zone. Activation is done by polling with
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| 	an interval of 1 second.
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| 	Unit: millidegrees Celsius
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| 	RW, Optional
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| 
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| *****************************
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| * Cooling device attributes *
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| *****************************
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| 
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| type
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| 	String which represents the type of device, e.g:
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| 	- for generic ACPI: should be "Fan", "Processor" or "LCD"
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| 	- for memory controller device on intel_menlow platform:
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| 	  should be "Memory controller".
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| 	RO, Required
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| 
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| max_state
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| 	The maximum permissible cooling state of this cooling device.
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| 	RO, Required
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| 
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| cur_state
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| 	The current cooling state of this cooling device.
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| 	The value can any integer numbers between 0 and max_state:
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| 	- cur_state == 0 means no cooling
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| 	- cur_state == max_state means the maximum cooling.
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| 	RW, Required
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| 
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| 3. A simple implementation
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| 
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| ACPI thermal zone may support multiple trip points like critical, hot,
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| passive, active. If an ACPI thermal zone supports critical, passive,
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| active[0] and active[1] at the same time, it may register itself as a
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| thermal_zone_device (thermal_zone1) with 4 trip points in all.
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| It has one processor and one fan, which are both registered as
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| thermal_cooling_device.
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| 
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| If the processor is listed in _PSL method, and the fan is listed in _AL0
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| method, the sys I/F structure will be built like this:
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| 
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| /sys/class/thermal:
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| 
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| |thermal_zone1:
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|     |---type:			acpitz
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|     |---temp:			37000
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|     |---mode:			kernel
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|     |---trip_point_0_temp:	100000
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|     |---trip_point_0_type:	critical
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|     |---trip_point_1_temp:	80000
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|     |---trip_point_1_type:	passive
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|     |---trip_point_2_temp:	70000
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|     |---trip_point_2_type:	active0
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|     |---trip_point_3_temp:	60000
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|     |---trip_point_3_type:	active1
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|     |---cdev0:			--->/sys/class/thermal/cooling_device0
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|     |---cdev0_trip_point:	1	/* cdev0 can be used for passive */
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|     |---cdev1:			--->/sys/class/thermal/cooling_device3
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|     |---cdev1_trip_point:	2	/* cdev1 can be used for active[0]*/
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| 
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| |cooling_device0:
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|     |---type:			Processor
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|     |---max_state:		8
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|     |---cur_state:		0
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| 
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| |cooling_device3:
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|     |---type:			Fan
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|     |---max_state:		2
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|     |---cur_state:		0
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| 
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| /sys/class/hwmon:
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| 
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| |hwmon0:
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|     |---name:			acpitz
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|     |---temp1_input:		37000
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|     |---temp1_crit:		100000
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